Product Description

Features:

1. Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,MTK,Intel, etc*-eMMC

2. Apply to BGA**9.

3. Accurate positioning on flat bottom pad and solder of eMMC.

4. Long operating life,up to *0,**0 times.

5. Apply to eMMC thickness:0.***1.5mm.

6. Could reading and writing the data of eMMC with it.

7. eMMC size : *1.5X*3mm,pitch:0.5mm.

8. Easy to operate,insert with the SD card reader into your PC, then could read.

9. Support flat bottom and solder ball testing.

 

Only one frame guide for each fixture default, please tell us you wanted size. If need more, you should pay another $*0 for per standard size plate.





We provide all kinds of IC test socket , eMMC/eMCP socket , SOP socket , TSOP socket , BGA socket and reballing fixture etc .



We're the original manufacturer , we can provide the excellent quality and competitve price , if you have any inquiry , please don't hesitate to contact us .